The ideal candidate will possess strong leadership capabilities combined with deep technical expertise in Microelectronics (MIC) and Manufacturing processes, including Die Attach, Eutectic Attach, Epoxy Attach, Wire Bonding, Ribbon Bonding, Pull Testing, Ball Shear, and Die Shear Analysis. This role requires a results-driven professional capable of leading continuous improvement initiatives, developing high-performing teams, managing customer quality requirements, and supporting a culture of operational excellence.
